About us
Torch Technology Co., Ltd was founded in November 2001, with its research and development center located in Beijing and factories in both Beijing and Jiangsu.
TORCH's main products consist of two primary series:
Traditional SMT (Surface Mount Technology) equipment: This includes solder paste Jet printers, solder paste stencil printers, dispensers, pick-and-place machines, reflow ovens, and wave soldering machines.
Semiconductor vacuum packaging equipment: These are primarily flip-chip bonders, submicron placement machines, eutectic die attach machines, vacuum reflow oven, eutectic furnaces, vacuum brazing furnaces, vacuum sintering oven, silver sintering equipment, vacuum annealing furnaces, and other high-end semiconductor packaging and soldering equipment.
Torch Technology Co., Ltd has invested significantly in the research and development of new products and processes, and to date has secured over 260 patents. The company is a leader in the field of small and medium-sized SMT assembly equipment and semiconductor packaging, with many products and processes driving the development of the industry.
Torch Technology Co., Ltd is dedicated to providing customers with advanced, efficient, and low-cost SMT assembly solutions and complete semiconductor packaging production line solutions. As a semiconductor advanced packaging equipment supplier that integrates "research and design, production, sales, installation, debugging, and after-sales service," we serve a broad range of electronic product assembly factories and semiconductor packaging factories worldwide.
Since its inception, the company has adhered to the philosophy of quality above all, striving to solve the technical difficulties encountered in the field of electronic assembly and semiconductor packaging. The company's vision and goal is to align with and surpass the world's advanced semiconductor packaging technology levels.
TORCH's main products consist of two primary series:
Traditional SMT (Surface Mount Technology) equipment: This includes solder paste Jet printers, solder paste stencil printers, dispensers, pick-and-place machines, reflow ovens, and wave soldering machines.
Semiconductor vacuum packaging equipment: These are primarily flip-chip bonders, submicron placement machines, eutectic die attach machines, vacuum reflow oven, eutectic furnaces, vacuum brazing furnaces, vacuum sintering oven, silver sintering equipment, vacuum annealing furnaces, and other high-end semiconductor packaging and soldering equipment.
Torch Technology Co., Ltd has invested significantly in the research and development of new products and processes, and to date has secured over 260 patents. The company is a leader in the field of small and medium-sized SMT assembly equipment and semiconductor packaging, with many products and processes driving the development of the industry.
Torch Technology Co., Ltd is dedicated to providing customers with advanced, efficient, and low-cost SMT assembly solutions and complete semiconductor packaging production line solutions. As a semiconductor advanced packaging equipment supplier that integrates "research and design, production, sales, installation, debugging, and after-sales service," we serve a broad range of electronic product assembly factories and semiconductor packaging factories worldwide.
Since its inception, the company has adhered to the philosophy of quality above all, striving to solve the technical difficulties encountered in the field of electronic assembly and semiconductor packaging. The company's vision and goal is to align with and surpass the world's advanced semiconductor packaging technology levels.
